ArticleScience advances2021
Direct gold bonding for flexible integrated electronics.
Article in Science advances, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 19 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
19 citing papers in PubMed.
- Low-Temperature and Room-Temperature Surface-Activated Au-Au Bonding: Surface Requirements, Preparation Methods, and Emerging Applications.Sensors (Basel, Switzerland) · 2026Review
- Gas-permeable and stretchable nanoscale anisotropic conductive film for room-temperature, pressure-free interconnections.Science advances · 2026Article
- Three-Dimensional Interconnect Technologies for Advanced Flexible Electronics.Advanced materials (Deerfield Beach, Fla.) · 2026Review
- Flexible Dielectric Acoustic Resonator Patch for Tissue Regeneration.Advanced materials (Deerfield Beach, Fla.) · 2026Article
- Characterization of an Ultra-Thin Silicon Strain Gauge Exposed to Gamma Ray Irradiation.Sensors (Basel, Switzerland) · 2026Article
- A Strain Decoupling Packaging Strategy for High-Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026Article
- Robust Full-Surface Bonding of Substrate and Electrode for Ultra-Flexible Sensor Integration.Advanced materials (Deerfield Beach, Fla.) · 2025Article
- From Printed Devices to Vertically Stacked, 3D Flexible Hybrid Systems.Advanced materials (Deerfield Beach, Fla.) · 2025Review
- Regio-Selective Mechanical Enhancement of Polymer-Grafted Nanoparticle Composites via Light-Mediated Crosslinking.Advanced materials (Deerfield Beach, Fla.) · 2025Article
- Simultaneous Necking and Barreling Deformation Behaviors in Bending of Single-Crystal Gold Micro-Cantilever.Materials (Basel, Switzerland) · 2024Article
- An ultraflexible energy harvesting-storage system for wearable applications.Nature communications · 2024Article
- Electrically weldable conductive elastomers.Science advances · 2024Article
- Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion.Nature communications · 2024Article
- Digital automation of transdermal drug delivery with high spatiotemporal resolution.Nature communications · 2024Article
- A monolithically integrated in-textile wristband for wireless epidermal biosensing.Science advances · 2023Article
- Recent Progress in Flexible and Wearable All Organic Photoplethysmography Sensors for SpOAdvanced science (Weinheim, Baden-Wurttemberg, Germany) · 2023Review
- Technology Roadmap for Flexible Sensors.ACS nano · 2023Review
- Enhancing the interfacial binding strength between modular stretchable electronic components.National science review · 2023Review
- A combined gas-phase dissociative ionization, dissociative electron attachment and deposition study on the potential FEBID precursor [Au(CHBeilstein journal of nanotechnology · 2023Article
Corrections and comments
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Authors and funding
7 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
Flexible and stable interconnections are critical for the next generation of shape-conformable and wearable electronics. These interconnections should have metal-like conductivity and sufficiently low stiffness that does not compromise the flexibility of the device; moreover, they must be achieved using low-temperature processes to prevent device damage. However, conventional interconnection bonding methods require additional adhesive layers, making it challenging to achieve these characteristics simultaneously. Here, we develop and characterize water vapor plasma–assisted bonding (WVPAB) that enables direct bonding of gold electrodes deposited on ultrathin polymer films. WVPAB bonds rough gold electrodes at room temperature and atmospheric pressure in ambient air. Hydroxyl groups generated by the plasma assist bonding between two gold surfaces, allowing the formation of a strong and stable interface. The applicability of WVPAB-mediated connections to ultrathin electronic systems was also demonstrated, and ultraflexible organic photovoltaics and light-emitting diodes fabricated on separate films were successfully interconnected via ultrathin wiring films.
Identifiers
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.