ArticleMicromachines2021
Low-Energy Pulsed Ion Beam Technology with Ultra-High Material Removal Resolution and Widely Adjustable Removal Efficiency.
Article in Micromachines, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Who cites it
5 citing papers in PubMed, 13 citations in OpenAlex.
- Atomic Depth Image Transfer of Large-Area Optical Quartz Materials Based on Pulsed Ion Beam.Micromachines · 2024Article
- Enhancing Thickness Uniformity of NbMicromachines · 2024Article
- Ultra-Smooth Polishing of Single-Crystal Silicon Carbide by Pulsed-Ion-Beam Sputtering of Quantum-Dot Sacrificial Layers.Materials (Basel, Switzerland) · 2023Article
- Figuring Method of High Convergence Ratio for Pulsed Ion Beams Based on Frequency-Domain Parameter Control.Micromachines · 2022Article
- Nonlinear Effects of Pulsed Ion Beam in Ultra-High Resolution Material Removal.Micromachines · 2022Article
Corrections and comments
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Authors and funding
9 authors at 2 institutions in 1 country.
Funding
No grant is acknowledged in the PubMed record.
Abstract
High-precision optical component manufacturing by ion beam machining tools with ultra-high material removal resolution and dynamically adjustable removal efficiency is important in various industries. In this paper, we propose a low-energy pulsed ion beam (LPIB) technology that can obtain a single pulse with high-resolution material removal by adjusting the pulse frequency and duty cycle, and enable the dynamic adjustment of the removal efficiency. The pulse frequency is 1-100 Hz, and the duty cycle is 0-100%. For monocrystalline silicon, the pulse frequency and duty cycle are set to 100 Hz and 1%, respectively; thus, the single-shot pulse depth removal resolution of material is 6.7 × 10
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Registered trials
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