ArticleNature communications2021
Author Correction: Battery-free, wireless soft sensors for continuous multi-site measurements of pressure and temperature from patients at risk for pressure injuries.
Abstract readPublished Erratum
In one paragraph
Article in Nature communications, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
0numbers the graph read from it
0cells of the map it votes in
1citing papers in PubMed
–field-weighted citation impact
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
1 citing paper in PubMed.
- How Do Everyday Life Activities Affect Seating Pressure Measurements?International journal of spine surgery · 2023Article
Corrections and comments
- Erratum for
Authors and funding
58 authors.
Yong Suk Oh *Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0002-5370-2781
Jae-Hwan Kim *Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Zhaoqian Xie *State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.ORCID http://orcid.org/0000-0003-1320-817X
Seokjoo ChoDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.ORCID http://orcid.org/0000-0001-5499-1266
Hyeonseok HanDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Sung Woo JeonDepartment of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Minsu ParkQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
Myeong NamkoongDepartment of Biomedical Engineering, Texas A&M University, College Station, TX, USA.
Raudel AvilaDepartment of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
Zhen SongState Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.
Sung-Uk LeeAdvanced 3D Printing Technology Development Division, Korea Atomic Energy Research Institute, Daejeon, Republic of Korea.
Kabseok KoQualcomm Institute, La Jolla, CA, USA.
Jungyup LeeSibel Health Inc, Niles, IL, USA.
Je-Sang LeeDepartment of Rehabilitation Medicine, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.
Weon Gi MinDepartment of Planning and Development, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.
Byeong-Ju LeeDepartment of Rehabilitation Medicine, Pusan national university hospital, Busan, Republic of Korea.ORCID http://orcid.org/0000-0002-7250-8909
Myungwoo ChoiDepartment of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Ha Uk ChungSibel Health Inc, Niles, IL, USA.
Jongwon KimSibel Health Inc, Niles, IL, USA.
Mengdi HanDepartment of Biomedical Engineering, College of Future Technology, Peking University, Beijing, People's Republic of China.
Jahyun KooSchool of Biomedical Engineering, Korea University, Seoul, Republic of Korea.
Yeon Sik ChoiCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0003-3813-3442
Sung Soo KwakQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
Sung Bong KimDepartment of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
Jeonghyun KimDepartment of Electronic Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea.ORCID http://orcid.org/0000-0003-3090-1435
Jungil ChoiSchool of Mechanical Engineering, Kookmin University, Seoul, Republic of Korea.ORCID http://orcid.org/0000-0002-3659-8978
Chang-Mo KangDepartment of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA.
Jong Uk KimQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
Kyeongha KwonSchool of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Sang Min WonDepartment of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.ORCID http://orcid.org/0000-0002-5750-8628
Janice Mihyun BaekDepartment of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
Yujin LeeDepartment of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
So Young KimDepartment of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
Wei LuCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
Abraham Vazquez-GuardadoCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0002-0648-5921
Hyoyoung JeongQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0002-1808-7824
Hanjun RyuCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0002-3268-9661
Geumbee LeeCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
Kyuyoung KimDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Seunghwan KimDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Min Seong KimDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Jungrak ChoiDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Dong Yun ChoiBiomedical Manufacturing Technology Center, Korea Institute of Industrial Technology (KITECH), Yeongcheon, Republic of Korea.
Quansan YangQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0001-8029-1327
Hangbo ZhaoDepartment of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, USA.ORCID http://orcid.org/0000-0001-5229-4192
Wubin BaiDepartment of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA.ORCID http://orcid.org/0000-0003-2872-5559
Hokyung JangDepartment of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI, USA.ORCID http://orcid.org/0000-0002-7797-9881
Yongjoon YuNeuroLux, Inc, Glenview, IL, USA.
Jaeman LimQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0003-4542-2867
Xu GuoState Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.
Bong Hoon KimDepartment of Organic Materials and Fiber Engineering, Soongsil University, Seoul, Republic of Korea.
Seokwoo JeonDepartment of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.ORCID http://orcid.org/0000-0002-5338-0671
Charles DaviesCarle Neuroscience Institute, Carle, Physician Group, Urbana, IL, USA.ORCID http://orcid.org/0000-0002-4427-8683
Anthony BanksCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
Hyung Jin SungDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Yonggang HuangCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.ORCID http://orcid.org/0000-0002-0483-8359
Inkyu ParkDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. inkyu@kaist.ac.kr.
John A RogersCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.ORCID http://orcid.org/0000-0002-2980-3961
Funding
No grant is acknowledged in the PubMed record.
Abstract
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