ReviewPolymers2021
Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review.
Review in Polymers, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 8 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
8 citing papers in PubMed.
- Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies.Micromachines · 2026Review
- Adhesives and Sealants in Packaging: Advanced Materials, Performance, and Emerging Technologies (Part II).Materials (Basel, Switzerland) · 2026Review
- Adhesives and Sealants in Packaging: Functional Roles and System-Level Classification (Part I).Materials (Basel, Switzerland) · 2026Review
- Fabrication of high-strength and self-healing polyurethane compositesRSC advances · 2026Article
- High-Temperature Resistance of Anchorage System for Carbon Fiber-Reinforced Polymer Composite Cable-A Review.Polymers · 2024Review
- Preparation and performance of alumina/epoxy-siloxane composites: A comparative study on thermal- and photo-curing process.Heliyon · 2024Article
- N-Type Coating of Single-Walled Carbon Nanotubes by Polydopamine-Mediated Nickel Metallization.Nanomaterials (Basel, Switzerland) · 2023Article
- Comparison of the Properties of Epoxy Resins Containing Various Trifluoromethyl Groups with Low Dielectric Constant.Polymers · 2023Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
5 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.
Indexed as
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.