ReviewMicromachines2021
Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication.
Review in Micromachines, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 55 papers.
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Who cites it
55 citing papers in PubMed, 237 citations in OpenAlex.
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- Narrow-band asymmetric THz absorbers and polarizers based on impedance-matched, cloaked quasi-BICs in doped Ge microdisk metasurfaces.iScience · 2026Article
- Multi-step femtosecond laser-fabricated membranes for regulated migration of biomolecules and cells.bioRxiv : the preprint server for biology · 2026Article
- Atomic Layer Etching of Nickel Using NACS applied electronic materials · 2026Article
- Two-dimensional crystalline hard masks for high-aspect-ratio nanofabrication.Nature materials · 2026Article
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- Advances in microneedle Technology for Treatment of retinal degenerative diseases: a narrative review.Biomedical microdevices · 2026Review
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- Quasi-anisotropic wet etching of glass creates inclined microstructures for advanced optical and MEMS devices.Microsystems & nanoengineering · 2026Article
- Improving Adhesion of UHMWPE with Epoxy Matrix by Reactive Ion Etching of UHMWPE Using Ar-OACS applied materials & interfaces · 2025Article
- The role of 3D printing in skeletal muscle-on-a-chip models: Current applications and future potential.Materials today. Bio · 2025Article
- Nanophotonic Materials and Devices: Recent Advances and Emerging Applications.Micromachines · 2025Review
- Improved WTCN-Informer Model Based on Frequency-Enhanced Channel Attention Mechanism and Wavelet Convolution: Prediction of Remaining Service Life of Ion Etcher Cooling System.Sensors (Basel, Switzerland) · 2025Article
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- Fabrication and application of 3D Terahertz metamaterials with vertical multinanogaps for spectroscopic sensing.Scientific reports · 2025Article
Corrections and comments
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Authors and funding
1 author at 1 institution in 1 country.
Funding
No grant is acknowledged in the PubMed record.
Abstract
This paper reviews the recent advances in reaction-ion etching (RIE) for application in high-aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro- and nanofabrication has become a very important enabling technology particularly for bulk micromachining applications, but increasingly also for mainstream integrated circuit technology such as three-dimensional multi-functional systems integration. The characteristics of traditional RIE allow for high levels of anisotropy compared to competing technologies, which is important in microsystems device fabrication for a number of reasons, primarily because it allows the resultant device dimensions to be more accurately and precisely controlled. This directly leads to a reduction in development costs as well as improved production yields. Nevertheless, traditional RIE was limited to moderate etch depths (e.g., a few microns). More recent developments in newer RIE methods and equipment have enabled considerably deeper etches and higher aspect ratios compared to traditional RIE methods and have revolutionized bulk micromachining technologies. The most widely known of these technologies is called the inductively-coupled plasma (ICP) deep reactive ion etching (DRIE) and this has become a mainstay for development and production of silicon-based micro- and nano-machined devices. This paper will review deep high-aspect-ratio reactive ion etching technologies for silicon, fused silica (quartz), glass, silicon carbide, compound semiconductors and piezoelectric materials.
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.