ArticleNature communications2021
Battery-free, wireless soft sensors for continuous multi-site measurements of pressure and temperature from patients at risk for pressure injuries.
Erratum issuedOpen access · goldAbstract read
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Article in Nature communications, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. An erratum has been issued. Cited by 52 papers.
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52citing papers in PubMed
10.3field-weighted citation impact, top 1% of its field
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Who cites it
52 citing papers in PubMed, 178 citations in OpenAlex.
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Corrections and comments
- Erratum issued
Authors and funding
58 authors at 20 institutions in 4 countries.
Yong Suk Oh *Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0002-5370-2781
Jae-Hwan Kim *Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Zhaoqian Xie *State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.ORCID http://orcid.org/0000-0003-1320-817X
Seokjoo ChoDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.ORCID http://orcid.org/0000-0001-5499-1266
Hyeonseok HanDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Sung Woo JeonDepartment of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Minsu ParkQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
Myeong NamkoongDepartment of Biomedical Engineering, Texas A&M University, College Station, TX, USA.
Raudel AvilaDepartment of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
Zhen SongState Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.
Sung-Uk LeeAdvanced 3D Printing Technology Development Division, Korea Atomic Energy Research Institute, Daejeon, Republic of Korea.
Kabseok KoQualcomm Institute, La Jolla, CA, USA.
Jungyup LeeSibel Health Inc, Niles, IL, USA.
Je-Sang LeeDepartment of Rehabilitation Medicine, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.
Weon Gi MinDepartment of Planning and Development, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.
Byeong-Ju LeeDepartment of Rehabilitation Medicine, Pusan national university hospital, Busan, Republic of Korea.ORCID http://orcid.org/0000-0002-7250-8909
Myungwoo ChoiDepartment of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Ha Uk ChungSibel Health Inc, Niles, IL, USA.
Jongwon KimSibel Health Inc, Niles, IL, USA.
Mengdi HanDepartment of Biomedical Engineering, College of Future Technology, Peking University, Beijing, People's Republic of China.
Jahyun KooSchool of Biomedical Engineering, Korea University, Seoul, Republic of Korea.
Yeon Sik ChoiCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0003-3813-3442
Sung Soo KwakQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
Sung Bong KimDepartment of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
Jeonghyun KimDepartment of Electronic Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea.ORCID http://orcid.org/0000-0003-3090-1435
Jungil ChoiSchool of Mechanical Engineering, Kookmin University, Seoul, Republic of Korea.ORCID http://orcid.org/0000-0002-3659-8978
Chang-Mo KangDepartment of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA.
Jong Uk KimQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
Kyeongha KwonSchool of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Sang Min WonDepartment of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.ORCID http://orcid.org/0000-0002-5750-8628
Janice Mihyun BaekDepartment of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
Yujin LeeDepartment of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
So Young KimDepartment of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
Wei LuCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
Abraham Vazquez-GuardadoCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0002-0648-5921
Hyoyoung JeongQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0002-1808-7824
Hanjun RyuCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0002-3268-9661
Geumbee LeeCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
Kyuyoung KimDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Seunghwan KimDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Min Seong KimDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Jungrak ChoiDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Dong Yun ChoiBiomedical Manufacturing Technology Center, Korea Institute of Industrial Technology (KITECH), Yeongcheon, Republic of Korea.
Quansan YangQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0001-8029-1327
Hangbo ZhaoDepartment of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, USA.ORCID http://orcid.org/0000-0001-5229-4192
Wubin BaiDepartment of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA.ORCID http://orcid.org/0000-0003-2872-5559
Hokyung JangDepartment of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI, USA.ORCID http://orcid.org/0000-0002-7797-9881
Yongjoon YuNeuroLux, Inc, Glenview, IL, USA.
Jaeman LimQuerrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.ORCID http://orcid.org/0000-0003-4542-2867
Xu GuoState Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.
Bong Hoon KimDepartment of Organic Materials and Fiber Engineering, Soongsil University, Seoul, Republic of Korea.
Seokwoo JeonDepartment of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.ORCID http://orcid.org/0000-0002-5338-0671
Charles DaviesCarle Neuroscience Institute, Carle, Physician Group, Urbana, IL, USA.ORCID http://orcid.org/0000-0002-4427-8683
Anthony BanksCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
Hyung Jin SungDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
Yonggang HuangCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.ORCID http://orcid.org/0000-0002-0483-8359
Inkyu ParkDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea. inkyu@kaist.ac.kr.
John A RogersCenter for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.ORCID http://orcid.org/0000-0002-2980-3961
Northwestern University · USKorea Advanced Institute of Science and Technology · KRDalian University of Technology · CNSibel (United States) · USKookmin University · KRUniversity of Illinois Urbana-Champaign · USHansol Chemical (South Korea) · KRKorea Atomic Energy Research Institute · KRKorea Institute of Industrial Technology · KRKorea University · KRLux Research (United States) · USPeking University · CNPusan National University Hospital · KRQualcomm (United States) · USSoongsil University · KRSungkyunkwan University · KRTexas A&M University · USUniversity of North Carolina at Chapel Hill · USUniversity of Southern California · USUniversity of Wisconsin–Madison · US
Funding
No grant is acknowledged in the PubMed record.
Abstract
Capabilities for continuous monitoring of pressures and temperatures at critical skin interfaces can help to guide care strategies that minimize the potential for pressure injuries in hospitalized patients or in individuals confined to the bed. This paper introduces a soft, skin-mountable class of sensor system for this purpose. The design includes a pressure-responsive element based on membrane deflection and a battery-free, wireless mode of operation capable of multi-site measurements at strategic locations across the body. Such devices yield continuous, simultaneous readings of pressure and temperature in a sequential readout scheme from a pair of primary antennas mounted under the bedding and connected to a wireless reader and a multiplexer located at the bedside. Experimental evaluation of the sensor and the complete system includes benchtop measurements and numerical simulations of the key features. Clinical trials involving two hemiplegic patients and a tetraplegic patient demonstrate the feasibility, functionality and long-term stability of this technology in operating hospital settings.
Indexed as
Biosensing TechniquesElectric Power SuppliesPressurePressure UlcerTemperatureWireless TechnologyAdultAgedAged, 80 and overEquipment DesignFemaleHumansMaleMiddle AgedMonitoring, PhysiologicSkin
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