Evidence map›Paper›PMID 34337262›Full record

ArticleACS omega2021

Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method.

Ying Wang, Bo Tang, Yuan Gao, Xinfeng Wu, Jin Chen, Liming Shan, Kai Sun, Yuantao Zhao, Ke Yang, Jinhong Yu and 1 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in ACS omega, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 4 papers.

0numbers the graph read from it
0cells of the map it votes in
4citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

4 citing papers in PubMed.

  1. Review
  2. Article
  3. Review
  4. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

11 authors.

Ying WangMerchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China.
Bo TangMerchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China.
Yuan GaoMerchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China.ORCID https://orcid.org/0000-0001-6684-364X
Xinfeng WuMerchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China.
Jin ChenMerchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China.
Liming ShanMerchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China.
Kai SunMerchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China.ORCID https://orcid.org/0000-0001-7396-5813
Yuantao ZhaoMerchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China.
Ke YangSchool of Materials Science and Engineering, Central South University, Changsha 410083, China.ORCID https://orcid.org/0000-0003-4657-2402
Jinhong YuKey Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology & Engineering, Chinese Academy of Sciences, Ningbo 315201, China.ORCID https://orcid.org/0000-0001-9134-7568
Wenge LiMerchant Marine College, College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Heat dissipation problem is the primary factor restricting the service life of an electronic component. The thermal conductivity of materials has become a bottleneck that hinders the development of the electronic information industry (such as light-emitting diodes, 5G mobile phones). Therefore, the research on improving the thermal conductivity of materials has a very important theoretical value and a practical application value. Whether the thermally conductive filler in polymer composites can form a highly thermal conductive pathway is a key issue at this stage. The carbon fiber/carbon felt (CF/C felt) prepared in the study has a three-dimensional continuous network structure. The nickel-coated carbon fiber/carbon felt (CF/C/Ni felt) was fabricated by an electroplating deposition method. Three-dimensional CF/C/Ni/epoxy composites were manufactured by vacuum-assisted liquid-phase impregnation. By forming connection points between the adjacent carbon fibers, the thermal conduction path inside the felt can be improved so as to improve the thermal conductivity of the CF/C/Ni/epoxy composite. The thermal conductivity of the CF/C/Ni/epoxy composite (in-plane K

Identifiers

PMID34337262
PMCPMC8320143

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.