Evidence map›Paper›PMID 34204615›Full record

ArticlePolymers2021

An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films.

Marco Cen-Puc, Andreas Schander, Minerva G Vargas Gleason, Walter Lang

Abstract read
In one paragraph

Article in Polymers, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 11 papers.

0numbers the graph read from it
0cells of the map it votes in
11citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

11 citing papers in PubMed.

  1. Review
  2. Article
  3. Article
  4. Article
  5. Article
  6. A Simple and Cost-Effective FeClACS applied materials & interfaces · 2024
    Article
  7. Article
  8. Article
  9. Article
  10. Cleanroom strategies for micro- and nano-fabricating flexible implantable neural electronics.Philosophical transactions. Series A, Mathematical, physical, and engineering sciences · 2022
    Article
  11. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

4 authors.

Marco Cen-PucInstitute for Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany.
Andreas SchanderInstitute for Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany.ORCID 0000-0003-4138-3282
Minerva G Vargas GleasonInstitute for Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany.ORCID 0000-0002-1299-6998
Walter LangInstitute for Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

Indexed as

adhesionpeel strengthplasma treatmentpolyimide filmssurface modificationsurface wettability

Identifiers

PMID34204615
PMCPMC8231106

What OpenQuestion holds

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LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.