ReviewNanomaterials (Basel, Switzerland)2021
A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging.
Review in Nanomaterials (Basel, Switzerland), 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 9 papers.
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Who cites it
9 citing papers in PubMed, 88 citations in OpenAlex.
- Laser sintering of electrohydrodynamic inkjet-printed silver in microgravity for in-space manufacturing of electronic devices.NPJ advanced manufacturing · 2025Article
- Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications.Materials (Basel, Switzerland) · 2024Article
- Bonding Behavior and Quality of Pressureless Ag Sintering on (111)-Oriented Nanotwinned Cu Substrate in Ambient Air.Materials (Basel, Switzerland) · 2024Article
- Low-Temperature Sintering of Ag Composite Pastes with Different Metal Organic Decomposition Additions.Materials (Basel, Switzerland) · 2023Article
- Fabrication of Cu@Sn TLPS joint for high temperature power electronics application.RSC advances · 2022Article
- High Strength Die-Attach Joint Formation by Pressureless Sintering of Organic Amine Modified Ag Nanoparticle Paste.Nanomaterials (Basel, Switzerland) · 2022Article
- Effectiveness of Oxygen during Sintering of Silver Thin Films Derived by Nanoparticle Ink.Nanomaterials (Basel, Switzerland) · 2022Article
- Review
- Sintering Bonding of SiC Particulate Reinforced Aluminum Metal Matrix Composites by Using Cu Nanoparticles and Liquid Ga in Air.Nanomaterials (Basel, Switzerland) · 2021Article
Corrections and comments
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Authors and funding
1 author at 1 institution in 1 country.
Funding
Abstract
Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.