ArticleMicromachines2021
A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer.
Article in Micromachines, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 4 papers.
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Who cites it
4 citing papers in PubMed.
- Mechanically Exfoliated InP Thin Films for Solar Energy Conversion Devices.Small science · 2024Article
- Multi-Step Mechanical and Thermal Homogenization for the Warpage Estimation of Silicon Wafers.Micromachines · 2024Article
- An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding.Micromachines · 2023Article
- Multi-Grid Capacitive Transducers for Measuring the Surface Profile of Silicon Wafers.Micromachines · 2022Article
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Authors and funding
4 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the residual stress caused by glass frit bonding, is proposed. Finite element modeling showed that (2) by introducing this modification, the wafer out-of-plane deflection was decreased by 34%. Moreover, (3) fabricated wafers with the proposed geometrical feature demonstrated an improvement for the (4) warpage with respect to the plain wafers. A benefit for curvature variation and overall shape of the (5) bonded wafers was also observed.
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Registered trials
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