ArticleMaterials (Basel, Switzerland)2021
Exceptional Mechanical Properties and Heat Resistance of Photocurable Bismaleimide Ink for 3D Printing.
Article in Materials (Basel, Switzerland), 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 3 papers.
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Who cites it
3 citing papers in PubMed.
- Mechanical and Thermal Properties of DCPDA-Modified THEICTA/DMAA Photocurable Resins for LCD 3D Printing.Materials (Basel, Switzerland) · 2026Article
- Investigation into Thermomechanical Response of Polymer Composite Materials Produced through Additive Manufacturing Technologies.Materials (Basel, Switzerland) · 2022Article
- 3D printing of bone and cartilage with polymer materials.Frontiers in pharmacology · 2022Review
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Authors and funding
9 authors.
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Abstract
Photosensitive resins used in three-dimensional (3D) printing are characterized by high forming precision and fast processing speed; however, they often possess poor mechanical properties and heat resistance. In this study, we report a photocurable bismaleimide ink with excellent comprehensive performance for stereolithography (SLA) 3D printing. First, the main chain of bismaleimide with an amino group (BDM) was synthesized, and then, the glycidyl methacrylate was grafted to the amino group to obtain the bismaleimide oligomer with an unsaturated double bond. The oligomers were combined with reaction diluents and photo-initiators to form photocurable inks that can be used for SLA 3D printing. The viscosity and curing behavior of the inks were studied, and the mechanical properties and heat resistance were tested. The tensile strength of 3D-printed samples based on BDM inks could reach 72.6 MPa (166% of that of commercial inks), glass transition temperature could reach 155 °C (205% of that of commercial inks), and energy storage modulus was 3625 MPa at 35 °C (327% of that of commercial inks). The maximum values of T
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