ArticleMaterials (Basel, Switzerland)2021
Structure-Gas Barrier Property Relationship in a Novel Polyimide Containing Naphthalene and Amide Groups: Evaluation by Experiments and Simulations.
Yi Zeng, Yiwu Liu, Jinghua Tan, Jie Huang, Junjie Liu, Ao Tang, Chengliang Chen, Hong Chen
Open access · goldAbstract read
In one paragraphArticle in Materials (Basel, Switzerland), 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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5 · Who and what moneyAuthors and funding
8 authors at 2 institutions in 1 country.
Yi ZengState Key Laboratory for Powder Metallurgy, Centre South University, Changsha 410083, China.
Yiwu LiuNational and Local Joint Engineering Center of Advanced Packaging Materials R & D Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China.ORCID 0000-0001-7860-8532 Jinghua TanNational and Local Joint Engineering Center of Advanced Packaging Materials R & D Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China.ORCID 0000-0003-1642-5006 Jie HuangNational and Local Joint Engineering Center of Advanced Packaging Materials R & D Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China.
Junjie LiuNational and Local Joint Engineering Center of Advanced Packaging Materials R & D Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China.
Ao TangNational and Local Joint Engineering Center of Advanced Packaging Materials R & D Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China.
Chengliang ChenNational and Local Joint Engineering Center of Advanced Packaging Materials R & D Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China.
Hong ChenState Key Laboratory for Powder Metallurgy, Centre South University, Changsha 410083, China.
Hunan University of Technology · CNCentral South University · CN
Funding
YiWu Liu, JinHua Tan No. 51603066, U1730142, U1930203, No. 2019JJ40071, No. 18A257, No. 2018GK2063
6 · The paper itselfAbstract
In order to meet the increasingly stringent requirements for heat resistance and barrier properties in the packaging and electronic device encapsulation field. A high-barrier polyimide (NAPPI) contains naphthalene ring and amide group was prepared by polymerization of a novel diamine (NAPDA) and pyromellitic dianhydride. The structure and properties of diamine monomers and polymers were characterized. Results show that the NAPPI exhibits superior barrier properties with extremely low water vapor and oxygen transmission rate values of 0.14 g·m
Indexed as
amide groupbarrier propertiesmolecular simulationnaphthalene ringpolyimide
Identifiers
PMID33805799
PMCPMC7999945
OpenAlexW3138185425
What OpenQuestion holds
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LicenceCC BY
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