Evidence map›Paper›PMID 33670915›Full record

ArticleMaterials (Basel, Switzerland)2021

Surface Analysis of TMCTS-Based SiOC(H) Low-

Min Kyu Park, Wan Soo Song, Min Ho Kim, Sang Jeen Hong

Abstract read
In one paragraph

Article in Materials (Basel, Switzerland), 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

4 authors.

Min Kyu ParkDepartment of Electronics Engineering, Myongji University, Yongin 17058, Korea.
Wan Soo SongDepartment of Electronics Engineering, Myongji University, Yongin 17058, Korea.
Min Ho KimDepartment of Electronics Engineering, Myongji University, Yongin 17058, Korea.
Sang Jeen HongDepartment of Electronics Engineering, Myongji University, Yongin 17058, Korea.ORCID 0000-0002-6576-690X

Funding

Korea Evaluation Institute of Industrial Technology K_G012001079801Korea Institute for Advancement of Technology P0008458
6 · The paper itself

Abstract

The miniaturization of devices requires the introduction of a high aspect ratio through patterning in the Damascene copper interconnect process. The high aspect ratio etch process employs hardmasks, such as amorphous carbon, that can withstand high-powered plasma exposure. When an etch hardmask is removed after patterning, the properties of the underlying film can be altered by the effect of plasma exposure during the strip process. In this study, surface properties of SiOC(H) are investigated after an amorphous carbon strip with O

Indexed as

amorphous carbonhardmasklow-kOESSiOC(H)strip processsurface analysis

Identifiers

PMID33670915
PMCPMC7957736

What OpenQuestion holds

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LicenceCC BY
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Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.