ArticleNature communications2021
Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management.
Article in Nature communications, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 32 papers.
What it found
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The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
32 citing papers in PubMed.
- Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies.Micromachines · 2026Review
- Three-Dimensional Interconnect Technologies for Advanced Flexible Electronics.Advanced materials (Deerfield Beach, Fla.) · 2026Review
- Self-Sustaining Hybrid Passive Cooler Enabling Highly Effective Thermal Management for Outdoor Electronics.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026Article
- Highly Stretchable and Robust Composite Gel With Ultrahigh Inorganic Filler Loading.Small (Weinheim an der Bergstrasse, Germany) · 2026Article
- Flexible rubber with metal-like thermal conductivity achieved via hydrogen bonding engineering.Nature communications · 2026Article
- Metallic θ-phase tantalum nitride has a thermal conductivity triple that of copper.Science (New York, N.Y.) · 2026Article
- Advancing Thermal Management Technology for Power Semiconductors through Materials and Interface Engineering.Accounts of materials research · 2025Article
- Synthesis of hexagonal boron arsenide nanosheets for low-power consumption flexible memristors.Nature communications · 2025Article
- Machine Learning for Thermal Transport and Phonon High-order Anharmonicity in High Thermal Conductivity Materials: A Case Study in Boron Arsenide.Physical review materials · 2025Article
- Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling.Nature communications · 2025Article
- Bioinspired thermally conducting packaging for heat management of high performance electronic chips.Communications engineering · 2025Article
- Mechanochemistry-mediated colloidal liquid metals for electronic device cooling at kilowatt levels.Nature nanotechnology · 2025Article
- Nanoscale gradient interface for efficient heat transfer.Nature nanotechnology · 2025Article
- Electronic, Excitonic, and Optical Properties of Zinc Blende Boron Arsenide Tuned by Hydrostatic Pressure.ACS omega · 2024Article
- Nanoscale hyperthermia mesostructures for sustainable antimicrobial design.Cell reports. Physical science · 2024Article
- Transparent radiative cooling cover window for flexible and foldable electronic displays.Nature communications · 2024Article
- Deep-potential enabled multiscale simulation of gallium nitride devices on boron arsenide cooling substrates.Nature communications · 2024Article
- Article
- Review
- Non-Perturbative Determination of Isotope-induced Anomalous Vibrational Physics.Physical review. B · 2023Article
Corrections and comments
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Authors and funding
5 authors.
Funding
Abstract
Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal interface beyond the current state of the art, based on self-assembled manufacturing of cubic boron arsenide (s-BAs). The s-BAs exhibits highly desirable characteristics of high thermal conductivity up to 21 W/m·K and excellent elastic compliance similar to that of soft biological tissues down to 100 kPa through the rational design of BAs microcrystals in polymer composite. In addition, the s-BAs demonstrates high flexibility and preserves the high conductivity over at least 500 bending cycles, opening up new application opportunities for flexible thermal cooling. Moreover, we demonstrated device integration with power LEDs and measured a superior cooling performance of s-BAs beyond the current state of the art, by up to 45 °C reduction in the hot spot temperature. Together, this study demonstrates scalable manufacturing of a new generation of energy-efficient and flexible thermal interface that holds great promise for advanced thermal management of future integrated circuits and emerging applications such as wearable electronics and soft robotics.
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.