Evidence map›Paper›PMID 33572136›Full record

ArticleNanomaterials (Basel, Switzerland)2021

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films.

Saqib Rashid, Marco Sebastiani, Muhammad Zeeshan Mughal, Rostislav Daniel, Edoardo Bemporad

Abstract read
In one paragraph

Article in Nanomaterials (Basel, Switzerland), 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 7 papers.

0numbers the graph read from it
0cells of the map it votes in
7citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

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Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

7 citing papers in PubMed.

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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

5 authors.

Saqib RashidEngineering Department, University of Rome "Roma Tre", via della Vasca Navale 79, 00146 Rome, Italy.
Marco SebastianiEngineering Department, University of Rome "Roma Tre", via della Vasca Navale 79, 00146 Rome, Italy.ORCID 0000-0002-9574-1578
Muhammad Zeeshan MughalEngineering Department, University of Rome "Roma Tre", via della Vasca Navale 79, 00146 Rome, Italy.ORCID 0000-0001-9262-3085
Rostislav DanielDepartment of Materials Science, University of Leoben, Franz-Josef-Straße 18, 8700 Leoben, Austria.
Edoardo BemporadEngineering Department, University of Rome "Roma Tre", via della Vasca Navale 79, 00146 Rome, Italy.

Funding

H2020 Leadership in Enabling and Industrial Technologies 760827
6 · The paper itself

Abstract

In this work, the ternary titanium, copper, and silver (Ti-Cu-Ag) system is investigated as a potential candidate for the production of mechanically robust biomedical thin films. The coatings are produced by physical vapor deposition-magnetron sputtering (MS-PVD). The composite thin films are deposited on a silicon (100) substrate. The ratio between Ti and Cu was approximately kept one, with the variation of the Ag content between 10 and 35 at.%, while the power on the targets is changed during each deposition to get the desired Ag content. Thin film characterization is performed by X-ray diffraction (XRD), nanoindentation (modulus and hardness), to quantitatively evaluate the scratch adhesion, and atomic force microscopy to determine the surface topography. The residual stresses are measured by focused ion beam and digital image correlation method (FIB-DIC). The produced Ti-Cu-Ag thin films appear to be smooth, uniformly thick, and exhibit amorphous structure for the Ag contents lower than 25 at.%, with a transition to partially crystalline structure for higher Ag concentrations. The Ti-Cu control film shows higher values of 124.5 GPa and 7.85 GPa for modulus and hardness, respectively. There is a clear trend of continuous decrease in the modulus and hardness with the increase of Ag content, as lowest value of 105.5 GPa and 6 GPa for 35 at.% Ag containing thin films. In particular, a transition from the compressive (-36.5 MPa) to tensile residual stresses between 229 MPa and 288 MPa are observed with an increasing Ag content. The obtained results suggest that the Ag concentration should not exceed 25 at.%, in order to avoid an excessive reduction of the modulus and hardness with maintaining (at the same time) the potential for an increase of the antibacterial properties. In summary, Ti-Cu-Ag thin films shows characteristic mechanical properties that can be used to improve the properties of biomedical implants such as Ti-alloys and stainless steel.

Indexed as

FIB-DICmagnetron sputteringmechanical propertiesnanoindentationTi-Cu-Ag thin films

Identifiers

PMID33572136
PMCPMC7915568

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.