Evidence map›Paper›PMID 33401420›Full record

ArticlePolymers2021

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al

William Anderson Lee Sanchez, Chen-Yang Huang, Jian-Xun Chen, Yu-Chian Soong, Ying-Nan Chan, Kuo-Chan Chiou, Tzong-Ming Lee, Chih-Chia Cheng, Chih-Wei Chiu

Open access · goldAbstract read
In one paragraph

Article in Polymers, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 16 papers.

0numbers the graph read from it
0cells of the map it votes in
16citing papers in PubMed
5.1field-weighted citation impact, top 3% of its field
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

16 citing papers in PubMed, 93 citations in OpenAlex.

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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

9 authors at 2 institutions in 1 country.

William Anderson Lee SanchezDepartment of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan.ORCID 0000-0002-0414-3100
Chen-Yang HuangDepartment of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan.
Jian-Xun ChenDepartment of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan.
Yu-Chian SoongDepartment of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan.
Ying-Nan ChanMaterial and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu 31040, Taiwan.
Kuo-Chan ChiouMaterial and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu 31040, Taiwan.
Tzong-Ming LeeMaterial and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu 31040, Taiwan.
Chih-Chia ChengGraduate Institute of Applied Science and Technology, National Taiwan University of Science and Technology, Taipei 10607, Taiwan.ORCID 0000-0002-1605-6338
Chih-Wei ChiuDepartment of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan.ORCID 0000-0003-2258-2454
National Taiwan University of Science and Technology · TWIndustrial Technology Research Institute · TW

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

In this study, a thermal conductivity of 0.22 W·m

Indexed as

aluminum oxideboron nitridecoefficient of thermal expansionhybrid fillerthermal conductivityunderfill encapsulation

Identifiers

PMID33401420
PMCPMC7795928
OpenAlexW3114428776

What OpenQuestion holds

Textmetadata
LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.