ArticleMicromachines2020
Analysis of Frequency Drift of Silicon MEMS Resonator with Temperature.
Article in Micromachines, 2020. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 9 papers.
What it found
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Who cites it
9 citing papers in PubMed, 26 citations in OpenAlex.
- Electrostatically actuated MEMS resonators for magnetic and electric field sensing: a review.Microsystems & nanoengineering · 2026Review
- Temperature drift suppression and measurement dead zone elimination in differential MEMS resonant accelerometers using dual-mode operating method.Microsystems & nanoengineering · 2025Article
- Investigating a Detection Method for Viruses and Pathogens Using a Dual-Microcantilever Sensor.Micromachines · 2024Article
- Design of an Electromagnetic Micro Mirror Driving System for LiDAR.Sensors (Basel, Switzerland) · 2024Article
- Analysis of the Thermally Induced Packaging Effects on the Frequency Drift of Micro-Electromechanical System Resonant Accelerometer.Micromachines · 2023Article
- Concepts and Key Technologies of Microelectromechanical Systems Resonators.Micromachines · 2022Review
- Temperature Compensation Method Based on an Improved Firefly Algorithm Optimized Backpropagation Neural Network for Micromachined Silicon Resonant Accelerometers.Micromachines · 2022Article
- Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration".Micromachines · 2022Article
- Design and Optimization of the Resonator in a Resonant Accelerometer Based on Mode and Frequency Analysis.Micromachines · 2021Article
Corrections and comments
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Authors and funding
4 authors at 1 institution in 1 country.
Funding
Abstract
High-quality-factor Micro-Electro-Mechanical System (MEMS) resonators have been widely used in sensors and actuators to obtain great mechanical sensitivity. The frequency drift of resonator with temperature is a problem encountered practically. The paper focuses on the resonator frequency distribution law in the temperature range of-40 to 60 °C. The four-layer models were established to analyze thermal stress caused by temperature due to the mismatch of thermal expansion coefficients. The temperature variation leads to the transformation of stress, which leads to the shift of resonance frequency. The paper analyzes the influence of hard and soft adhesive package on the temperature coefficient of frequency. The resonant accelerometer was employed for the frequency measurements in the paper. In experiments, three types of adhesive dispensing patterns were implemented. The results are consistent with the simulation well. The optimal packaging method achieves -24.1 ppm/°C to -30.2 ppm/°C temperature coefficient of the resonator in the whole temperature range, close to the intrinsic property of silicon (-31 ppm).
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.