ArticleNanomaterials (Basel, Switzerland)2020
Effects of Curing Temperature on Bending Durability of Inkjet-Printed Flexible Silver Electrode.
Article in Nanomaterials (Basel, Switzerland), 2020. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Who cites it
1 citing paper in PubMed.
- Experimental Study of the Jetting Behavior of High-Viscosity Nanosilver Inks in Inkjet-Based 3D Printing.Nanomaterials (Basel, Switzerland) · 2022Article
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Authors and funding
4 authors.
Funding
Abstract
Flexible electrodes should have a good mechanical durability and electrical properties under even extreme bending and deformation conditions. We fabricated such an electrode using an inkjet printing system. In addition, annealing was perfo3rmed under curing temperatures of 150, 170, and 190 °C to improve the electrical resistance performance of the electrode. Scanning electron microscopy, X-ray diffraction, nanoindentation, and surface profile measurements were performed to measure and analyze the electrode characteristics and the change in the shape of the coffee ring. The bending deformation behavior of the electrode was predicted by simulations. To confirm the bending durability of the flexible electrode according to different curing temperatures, the bending deformation and electrical resistance were simultaneously tested. It was found that the electrode cured at a temperature of 170 °C could endure 20,185 bending cycles and had the best durability, which was consistent with the predicted simulation results. Moreover, the average specific resistance before the electrode was disconnected was 13.45 μΩ cm, which is similar to the conventional electrode value. These results are expected to increase the durability and life of flexible electrodes, which can be used in flexible electronic devices, sensors, and wearable devices that are subjected to significant bending deformation.
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