ArticleScientific reports2020
Inscribing diffraction grating inside silicon substrate using a subnanosecond laser in one photon absorption wavelength.
Article in Scientific reports, 2020. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 3 papers.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Who cites it
3 citing papers in PubMed.
- Femtosecond Laser Percussion Drilling of Silicon Using Repetitive Single Pulse, MHz-, and GHz-Burst Regimes.Micromachines · 2024Article
- A New Inner Fabrication Method of Internal Cavity in Metal under Compound Acoustic Fields.Micromachines · 2023Article
- InGaAs based gratings for UV-VIS spectrometer in prospective mRNA vaccine research.Optical and quantum electronics · 2022Article
Corrections and comments
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Authors and funding
3 authors.
Funding
Abstract
Using focused subnanosecond laser pulses at [Formula: see text] wavelength, modification of silicon into opaque state was induced. While silicon exhibits one-photon absorption at this wavelength, the modification was induced inside [Formula: see text]-thick silicon substrate without damaging top or bottom surfaces. The depth range of the focus position was investigated where inside of the substrate can be modified without damaging the surfaces. Using this technique, diffraction gratings were inscribed inside silicon substrate. Diffraction from the gratings were observed, and the diffraction angle well agreed with the theoretical value. These results demonstrate that this technique could be used for fabricating infrared optical elements in silicon.
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Registered trials
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