ArticleNanomaterials (Basel, Switzerland)2020
Continuous-Wave Laser-Induced Transfer of Metal Nanoparticles to Arbitrary Polymer Substrates.
Article in Nanomaterials (Basel, Switzerland), 2020. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.
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Who cites it
5 citing papers in PubMed.
- Mini-review on laser-induced nanoparticle heating and melting.Frontiers in chemistry · 2024Review
- Preparation of Dispersed Copper(II) Oxide Nanosuspensions as Precursor for Femtosecond Reductive Laser Sintering by High-Energy Ball Milling.Nanomaterials (Basel, Switzerland) · 2023Article
- Direct Writing of Functional Layer by Selective Laser Sintering of Nanoparticles for Emerging Applications: A Review.Materials (Basel, Switzerland) · 2022Review
- A Transformative Gold Patterning through Selective Laser Refining of Cyanide.Nanomaterials (Basel, Switzerland) · 2021Article
- Towards laser printing of magnetocaloric structures by inducing a magnetic phase transition in iron-rhodium nanoparticles.Scientific reports · 2021Article
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Authors and funding
9 authors.
Funding
Abstract
Laser-induced forward transfer (LIFT) and selective laser sintering (SLS) are two distinct laser processes that can be applied to metal nanoparticle (NP) ink for the fabrication of a conductive layer on various substrates. A pulsed laser and a continuous-wave (CW) laser are utilized respectively in the conventional LIFT and SLS processes; however, in this study, CW laser-induced transfer of the metal NP is proposed to achieve simultaneous sintering and transfer of the metal NP to a wide range of polymer substrates. At the optimum laser parameters, it was shown that a high-quality uniform metal conductor was created on the acceptor substrate while the metal NP was sharply detached from the donor substrate, and we anticipate that such an asymmetric transfer phenomenon is related to the difference in the adhesion strengths. The resultant metal electrode exhibits a low resistivity that is comparable to its bulk counterpart, together with strong adhesion to the target polymer substrate. The versatility of the proposed process in terms of the target substrate and applicable metal NPs brightens its prospects as a facile manufacturing scheme for flexible electronics.
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