ArticleACS omega2020
Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating.
Article in ACS omega, 2020. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.
What it found
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The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
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Who cites it
5 citing papers in PubMed, 67 citations in OpenAlex.
- Hierarchical Malachite Microsphere Catalyst in the Ethynylation of Formaldehyde for 1,4-Butynediol Synthesis.ACS omega · 2025Article
- Electroplated Copper Additives for Advanced Packaging: A Review.ACS omega · 2024Review
- Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications.ACS omega · 2024Article
- Synthesis and antimycotic activity of new derivatives of imidazo[1,2-Beilstein journal of organic chemistry · 2024Article
- Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating.ACS omega · 2023Article
Corrections and comments
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Authors and funding
9 authors at 1 institution in 1 country.
Funding
No grant is acknowledged in the PubMed record.
Abstract
A copolymer comprising of pyrrole and 1,4-butanediol diglycidyl ether (PBDGE) was designed and synthesized as a leveler to improve the throwing power for printed circuit board (PCB) through-hole electroplating. The results of linear sweep voltammetry (LSV), galvanostatic measurements (GMs), and cyclic voltammetry (CV) reveal the strong coordination effect of PBDGE with other additives and confirm the advantageous performance of PBDGE to effectively assist the electroplating of through-hole. An increment of 35.5% in the throwing power was achieved under the addition of PBDGE in through-hole plating. Additionally, the reaction mechanism was studied by quantum chemical calculations and molecular dynamics (MD) simulations, indicating that the pyrrole rings of the PBDGE molecule are adsorbed on the copper surface as the adsorption sites to balance the copper plating regardless of the through-hole position differences.
Identifiers
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Registered trials
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