ArticleSensors (Basel, Switzerland)2020
Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer.
Article in Sensors (Basel, Switzerland), 2020. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 4 papers.
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Who cites it
4 citing papers in PubMed.
- Study on Spatiotemporal Variation in Internal Temperature Field in Quartz Flexible Accelerometer.Micromachines · 2025Article
- A Semi-Linear Elliptic Model for a Circular Membrane MEMS Device Considering the Effect of the Fringing Field.Sensors (Basel, Switzerland) · 2021Article
- A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer.Micromachines · 2021Article
- Research on High-Resolution Miniaturized MEMS Accelerometer Interface ASIC.Sensors (Basel, Switzerland) · 2020Article
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Authors and funding
7 authors.
Funding
Abstract
Capacitive MEMS accelerometers with area-variable periodic-electrode displacementtransducers found wide applications in disaster monitoring, resource exploration and inertialnavigation. The bonding-induced warpage, due to the difference in the coefficients of thermalexpansion of the bonded slices, has a negative influence on the precise control of the interelectrodespacing that is essential to the sensitivity of accelerometers. In this work, we propose the theory,simulation and experiment of a method that can alleviate both the stress and the warpage byapplying different bonding temperature on the bonded slices. A quasi-zero warpage is achievedexperimentally, proving the feasibility of the method. As a benefit of the flat surface, the spacing ofthe capacitive displacement transducer can be precisely controlled, improving the self-noise of theaccelerometer to 6 ng/√Hz @0.07 Hz, which is about two times lower than that of the accelerometerusing a uniform-temperature bonding process.
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