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ArticleMicromachines2020

Effect of Contact Plug Deposition Conditions on Junction Leakage and Contact Resistance in Multilevel CMOS Logic Interconnection Device.

Yinhua Cui et al.PubMed ↗Full text ↗Publisher ↗

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1 paper cites it

2020
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Full record →Abstract, authors, funding and every citing paper · PMID 32041270