Resistance Change Mechanism of Electronic Component Mounting through Contact Pressure Using Elastic Adhesive.

Abstract read

In one paragraph

Article in Micromachines, 2019. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it

0cells of the map it votes in

1citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

Editorial for the Special Issue of Selected Papers from the 9th Symposium on Micro-Nano Science and Technology on Micromachines.Micromachines · 2019
Article

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

3 authors.

Takashi SatoDepartment of Applied Mechanics, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan. sato@iwaselab.amech.waseda.ac.jp.

Tomoya KoshiSensing System Research Center, National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba 305-8565, Japan. t.koshi@aist.go.jp.ORCID 0000-0003-3511-5740

Eiji IwaseDepartment of Applied Mechanics, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan. iwase@waseda.jp.ORCID 0000-0003-1770-4883

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

For mounting electronic components through contact pressure using elastic adhesives, a high contact resistance is an inevitable issue in achieving solderless wiring in a low-temperature and low-cost process. To decrease the contact resistance, we investigated the resistance change mechanism by measuring the contact resistance with various contact pressures and copper layer thicknesses. The contact resistivity decreased to 4.2 × 10

Indexed as

contact pressurecontact resistanceflexible electronic devicesurface mounting

Identifiers

PMID31207964

DOI10.3390/mi10060396

PMCPMC6631103

What OpenQuestion holds

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LicenceCC BY

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.