ArticlePolymers2019
Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics.
Article in Polymers, 2019. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 8 papers.
What it found
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Who cites it
8 citing papers in PubMed.
- Multifaceted Shape Memory Polymer Technology for Biomedical Application: Combining Self-Softening and Stretchability Properties.Polymers · 2023Article
- High Tensile Strength UV-Cured Castor Oil-Based Silicone-Modified Polyurethane Acrylates.ACS omega · 2022Article
- Flexible Materials for High-Resolution 3D Printing of Microfluidic Devices with Integrated Droplet Size Regulation.ACS applied materials & interfaces · 2021Article
- The Future of Neuroscience: Flexible and Wireless Implantable Neural Electronics.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2021Review
- Resins for Frontal Photopolymerization: Combining Depth-Cure and Tunable Mechanical Properties.Materials (Basel, Switzerland) · 2021Article
- One-Step Synthesis of Novel Renewable Vegetable Oil-Based Acrylate Prepolymers and Their Application in UV-Curable Coatings.Polymers · 2020Article
- Continuous Journey Toward Polymer Applications.Polymers · 2020Article
- Article
Corrections and comments
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Authors and funding
9 authors.
Funding
Abstract
Thiol-ene/acrylate-based shape memory polymers (SMPs) with tunable mechanical and thermomechanical properties are promising substrate materials for flexible electronics applications. These UV-curable polymer compositions can easily be polymerized onto pre-fabricated electronic components and can be molded into desired geometries to provide a shape-changing behavior or a tunable softness. Alternatively, SMPs may be prepared as a flat substrate, and electronic circuitry may be built directly on top by thin film processing technologies. Whichever way the final structure is produced, the operation of electronic circuits will be influenced by the electrical and mechanical properties of the underlying (and sometimes also encapsulating) SMP substrate. Here, we present electronic properties, such as permittivity and resistivity of a typical SMP composition that has a low glass transition temperature (between 40 and 60 °C dependent on the curing process) in different thermomechanical states of polymer. We fabricated parallel plate capacitors from a previously reported SMP composition (fully softening (FS)-SMP) using two different curing processes, and then we determined the electrical properties of relative permittivity and resistivity below and above the glass transition temperature. Our data shows that the curing process influenced the electrical permittivity, but not the electrical resistivity. Corona-Kelvin metrology evaluated the quality of the surface of FS-SMP spun on the wafer. Overall, FS-SMP demonstrates resistivity appropriate for use as an insulating material.
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.