Evidence map›Paper›PMID 30400470›Full record

ArticleMicromachines2017

Introduction of a Chemical-Free Metal PDMS Thermal Bonding for Fabrication of Flexible Electrode by Metal Transfer onto PDMS.

Domin Koh, Anyang Wang, Phil Schneider, Brett Bosinski, Kwang W Oh

Abstract read
In one paragraph

Article in Micromachines, 2017. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.

0numbers the graph read from it
0cells of the map it votes in
5citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

5 citing papers in PubMed.

  1. Article
  2. Recovery of 17β-Estradiol Using 3D Printed Polyamide-12 Scavengers.3D printing and additive manufacturing · 2023
    Article
  3. Double-Framed Thin Elastomer Devices.ACS applied materials & interfaces · 2020
    Article
  4. Article
  5. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

5 authors.

Domin KohSMALL (Sensors and MicroActuators Learning Lab), Department of Electrical Engineering, State University of New York at Buffalo (SUNY-Buffalo), Buffalo, NY 14260, USA. dominkoh@buffalo.edu.ORCID 0000-0002-6515-5543
Anyang WangSMALL (Sensors and MicroActuators Learning Lab), Department of Electrical Engineering, State University of New York at Buffalo (SUNY-Buffalo), Buffalo, NY 14260, USA. anyangwa@buffalo.edu.
Phil SchneiderSMALL (Sensors and MicroActuators Learning Lab), Department of Electrical Engineering, State University of New York at Buffalo (SUNY-Buffalo), Buffalo, NY 14260, USA. philschn@buffalo.edu.
Brett BosinskiSMALL (Sensors and MicroActuators Learning Lab), Department of Electrical Engineering, State University of New York at Buffalo (SUNY-Buffalo), Buffalo, NY 14260, USA. brettbos@buffalo.edu.ORCID 0000-0001-6333-9982
Kwang W OhSMALL (Sensors and MicroActuators Learning Lab), Department of Electrical Engineering, State University of New York at Buffalo (SUNY-Buffalo), Buffalo, NY 14260, USA. kwangoh@buffalo.edu.ORCID 0000-0003-0078-6683

Funding

National Science Foundation CBET-1337860National Science Foundation CBET-1403086
6 · The paper itself

Abstract

Polydimethylsiloxane (PDMS) is a flexible and biocompatible material widely used in the fabrication of microfluidic devices, and is often studied for the fabrication of flexible electrodes. The most popular method of fabricating a flexible electrode using PDMS is done by transferring a metal electrode onto said PDMS. However, the transfer process is difficult and the transferred metal layer is easily damaged due to inherently weak adhesion forces between the metal and PDMS, thus requiring a chemical treatment or sacrificial layer between the two. The fabrication process using a chemical treatment or sacrificial layer is complicated and expensive, which is the major limitation of using PDMS in the fabrication of flexible electrodes. This paper discusses the findings of a possible solution to create strong bonding between PDMS and various metals (copper, nickel and silver) using a chemical-free metal to PDMS thermal bonding technique. This method is the same as the PDMS curing process, but with a variation in the curing condition. The condition required to create strong bonding was studied by observing copper transferred by various PDMS curing conditions, including the standard condition. The condition creating the strong bonding was baking PDMS (5:1 = base polymer: curing agent) at 150 °C for 20 min. Experimentation showed that the optimum thickness of the transferred metal shows that the optimum thickness is approximately 500 nm, which allows for a higher resistance to stresses. The successful transfer of copper, nickel and silver layers onto PDMS with a stronger adhesion force opens up many new applications dealing with the fabrication of flexible electrodes, sensors, and flexible soft magnets.

Indexed as

chemical-free PDMS-metal bondingflexible electrodesmetal and PDMS bondingvarious metal transfer

Identifiers

PMID30400470
PMCPMC6190368

What OpenQuestion holds

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.