Evidence map›Paper›PMID 29641889›Full record

ArticleACS nano2018

Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process.

Bong Hoon Kim, Jungyup Lee, Sang Min Won, Zhaoqian Xie, Jan-Kai Chang, Yongjoon Yu, Youn Kyoung Cho, Hokyung Jang, Ji Yoon Jeong, Yechan Lee and 22 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in ACS nano, 2018. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 11 papers.

0numbers the graph read from it
0cells of the map it votes in
11citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

11 citing papers in PubMed.

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4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

32 authors.

Bong Hoon KimDepartments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States.ORCID 0000-0002-4610-0176
Jungyup LeeFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Sang Min WonFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Zhaoqian XieDepartment of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering , Northwestern University , Evanston , Illinois 60208 , United States.
Jan-Kai ChangFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Yongjoon YuFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Youn Kyoung ChoFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Hokyung JangFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Ji Yoon JeongFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Yechan LeeFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Arin RyuFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Do Hoon KimFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Kun Hyuck LeeDepartments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States.
Jong Yoon LeeFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Fei LiuCenter for Mechanics and Materials, Center for Flexible Electronics Technology, AML, Department of Engineering Mechanics , Tsinghua University , Beijing 100084 , China.
Xueju WangDepartments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States.
Qingze HuoDepartment of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering , Northwestern University , Evanston , Illinois 60208 , United States.
Seunghwan MinFrederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
Di WuDepartment of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering , Northwestern University , Evanston , Illinois 60208 , United States.
Bowen JiDepartment of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering , Northwestern University , Evanston , Illinois 60208 , United States.
Anthony BanksDepartments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States.
Jeonghyun KimDepartment of Electronics Convergence Engineering , Kwangwoon University , Seoul 01897 , Republic of Korea.
Nuri OhDivision of Materials Science and Engineering , Hanyang University , Seoul 04763 , Republic of Korea.ORCID 0000-0001-9145-8911
Hyeong Min JinInstitute for Molecular Engineering , The University of Chicago , Chicago , Illinois 60637 , United States.
Seungyong HanDepartment of Mechanical Engineering , Ajou University , Suwon , 443-749 , Republic of Korea.
Daeshik KangDepartment of Mechanical Engineering , Ajou University , Suwon , 443-749 , Republic of Korea.
Chi Hwan LeeWeldon School of Biomedical Engineering, School of Mechanical Engineering, The Center for Implantable Devices, and Birck Nanotechnology Center , Purdue University , West Lafayette , Indiana 47907 , United States.
Young Min SongSchool of Electrical Engineering and Computer Science , Gwangju Institute of Science and Technology (GIST) , Gwangju 61005 , Republic of Korea.
Yihui ZhangCenter for Mechanics and Materials, Center for Flexible Electronics Technology, AML, Department of Engineering Mechanics , Tsinghua University , Beijing 100084 , China.
Yonggang HuangDepartment of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering , Northwestern University , Evanston , Illinois 60208 , United States.
Kyung-In JangDepartment of Robotics Engineering , Daegu Gyeongbuk Institute of Science and Technology (DGIST) , Daegu 42988 , Republic of Korea.
John A RogersDepartments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States.ORCID 0000-0002-2980-3961

Funding

SCH: Interface Monitoring System to Promote Residual Limb HealthR01EB019337 · NIBIB · NORTHWESTERN UNIVERSITY AT CHICAGO · PI COLEMAN, TODD P, FATONE, STEFANIA · 2014 to 2017
$1.5M
NIBIB NIH HHS R01 EB019337
6 · The paper itself

Abstract

Recently developed approaches in deterministic assembly allow for controlled, geometric transformation of two-dimensional structures into complex, engineered three-dimensional layouts. Attractive features include applicability to wide ranging layout designs and dimensions along with the capacity to integrate planar thin film materials and device layouts. The work reported here establishes further capabilities for directly embedding high-performance electronic devices into the resultant 3D constructs based on silicon nanomembranes (Si NMs) as the active materials in custom devices or microscale components released from commercial wafer sources. Systematic experimental studies and theoretical analysis illustrate the key ideas through varied 3D architectures, from interconnected bridges and coils to extended chiral structures, each of which embed n-channel Si NM MOSFETs (nMOS), Si NM diodes, and p-channel silicon MOSFETs (pMOS). Examples in stretchable/deformable systems highlight additional features of these platforms. These strategies are immediately applicable to other wide-ranging classes of materials and device technologies that can be rendered in two-dimensional layouts, from systems for energy storage, to photovoltaics, optoelectronics, and others.

Indexed as

ElectronicsFinite Element AnalysisLightingMechanical PhenomenaMetalsNanostructuresOxidesSiliconSilicon DioxideMetalsOxidesSiliconSilicon Dioxidemechanical bucklingsilicon diodesilicon transistorthree-dimensional electronics

Identifiers

PMID29641889
PMCPMC5986289

What OpenQuestion holds

Textmetadata
LicenceTDM
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.