ArticleNature communications2017
Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections.
Article in Nature communications, 2017. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 6 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
6 citing papers in PubMed.
- Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls.Journal of materials science. Materials in electronics · 2025Article
- Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling.Journal of materials science. Materials in electronics · 2025Article
- The role of microstructure in the thermal fatigue of solder joints.Nature communications · 2024Article
- A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy.Nanomaterials (Basel, Switzerland) · 2024Article
- CoSnNanomaterials (Basel, Switzerland) · 2022Article
- Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints.Materials (Basel, Switzerland) · 2022Review
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
6 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
While many aspects of electronics manufacturing are controlled with great precision, the nucleation of tin in solder joints is currently left to chance. This leads to a widely varying melt undercooling and different crystal orientations in each joint, which results in a different resistance to electromigration, thermomechanical fatigue, and other failure modes in each joint. Here we identify a family of nucleants for tin, prove their effectiveness using a novel droplet solidification technique, and demonstrate an approach to incorporate the nucleants into solder joints to control the orientation of the tin nucleation event. With this approach, it is possible to change tin nucleation from a stochastic to a deterministic process, and to generate single-crystal joints with their c-axis orientation tailored to best combat a selected failure mode.
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.