ArticleProceedings of SPIE--the International Society for Optical Engineering2016
Optimizing noise for defect analysis with through-focus scanning optical microscopy.
Article in Proceedings of SPIE--the International Society for Optical Engineering, 2016. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 4 papers.
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Who cites it
4 citing papers in PubMed, 11 citations in OpenAlex.
- Detecting nanoscale contamination in semiconductor fabrication using through-focus scanning optical microscopy.Journal of vacuum science and technology. B, Nanotechnology & microelectronics : materials, processing, measurement, & phenomena : JVST B · 2020Article
- Nondestructive shape process monitoring of three-dimensional high aspect ratio targets using through-focus scanning optical microscopy.Measurement science & technology · 2018Article
- Fidelity test for through-focus or volumetric type of optical imaging methods.Optics express · 2018Article
- Optical microscope illumination analysis using through-focus scanning optical microscopy.Optics letters · 2017Article
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Authors and funding
2 authors.
Funding
Abstract
Through-focus scanning optical microscopy (TSOM) shows promise for patterned defect analysis, but it is important to minimize total system noise. TSOM is a three-dimensional shape metrology method that can achieve sub-nanometer measurement sensitivity by analyzing sets of images acquired through-focus using a conventional optical microscope. Here we present a systematic noise-analysis study for optimizing data collection and data processing parameters for TSOM and then demonstrate how the optimized parameters affect defect analysis. We show that the best balance between signal-to-noise performance and acquisition time can be achieved by judicious spatial averaging. Correct background-signal subtraction of the imaging-system inhomogeneities is also critical, as well as careful alignment of the constituent images used in differential TSOM analysis.
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