ArticleSensors (Basel, Switzerland)2015
Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.
Article in Sensors (Basel, Switzerland), 2015. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.
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Who cites it
5 citing papers in PubMed.
- Metasurface-assisted bioelectronics: bridging photonic innovation with biomedical implants.Light, science & applications · 2025Article
- Bonding methods for chip integration with Parylene devices.Journal of micromechanics and microengineering : structures, devices, and systems · 2021Article
- Flexible Antennas: A Review.Micromachines · 2020Review
- A Sub-millimeter, Inductively Powered Neural Stimulator.Frontiers in neuroscience · 2017Article
- The Cluster Variation Method: A Primer for Neuroscientists.Brain sciences · 2016Article
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Authors and funding
6 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.
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