ArticleScientific reports2015
Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips.
Article in Scientific reports, 2015. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.
What it found
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Who cites it
5 citing papers in PubMed.
- Touch-Enabled Reversible Microfluidic Ultradense Chips for Convenient, High-Throughput Electrochemical Assays.ACS applied materials & interfaces · 2025Article
- Self-aligned multi-layer X-ray absorption grating using large-area fabrication methods for X-ray phase-contrast imaging.Scientific reports · 2023Article
- Perspectives in translating microfluidic devices from laboratory prototyping into scale-up production.Biomicrofluidics · 2022Article
- Simple sacrificial-layer-free microfabrication processes for air-cavity Fresnel acoustic lenses (ACFALs) with improved focusing performance.Microsystems & nanoengineering · 2022Article
- Self-regenerating and hybrid irreversible/reversible PDMS microfluidic devices.Scientific reports · 2016Article
Corrections and comments
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Authors and funding
7 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
A new protocol for fabrication of glass microchips is addressed in this research paper. Initially, the method involves the use of an uncured SU-8 intermediate to seal two glass slides irreversibly as in conventional adhesive bonding-based approaches. Subsequently, an additional step removes the adhesive layer from the channels. This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests. Named sacrificial adhesive layer (SAB), the protocol meets the requirements of an ideal microfabrication technique such as throughput, relatively low cost, feasibility for ultra large-scale integration (ULSI), and high adhesion strength, supporting pressures on the order of 5 MPa. Furthermore, SAB eliminates the use of high temperature, pressure, or potential, enabling the deposition of thin films for electrical or electrochemical experiments. Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature. Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives.
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.