ArticlePloS one2015
Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.
Article in PloS one, 2015. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 5 papers.
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Who cites it
5 citing papers in PubMed.
- Comprehensive Review on Research Status and Progress in Precision Grinding and Machining of BK7 Glasses.Micromachines · 2024Review
- Molecular Dynamics Study on Tip-Based Nanomachining: A Review.Nanoscale research letters · 2020Review
- Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching.Materials (Basel, Switzerland) · 2020Article
- Nanoindentation of Aluminum Single Crystals: Experimental Study on Influencing Factors.Materials (Basel, Switzerland) · 2019Article
- Interface-governed nanometric machining behaviour of Cu/Ag bilayers using molecular dynamics simulation.RSC advances · 2019Article
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Authors and funding
6 authors.
Funding
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Abstract
In the present work, we perform experiments and molecular dynamics simulations to elucidate the underlying deformation mechanisms of single crystalline copper under the load-controlled multi-passes nanoscratching using a triangular pyramidal probe. The correlation of microscopic deformation behavior of the material with macroscopically-observed machining results is revealed. Moreover, the influence of crystallographic orientation on the nanoscratching of single crystalline copper is examined. Our simulation results indicate that the plastic deformation of single crystalline Cu under the nanoscratching is exclusively governed by dislocation mechanisms. However, there is no glissile dislocation structure formed due to the probe oscillation under the load-controlled mode. Both experiments and MD simulations demonstrate that the machined surface morphologies in terms of groove depth and surface pile-up exhibit strong crystallographic orientation dependence, because of different geometries of activated slip planes cutting with free surfaces and strain hardening abilities associated with different crystallographic orientations.
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